|Supplier Slogan||Creative, Innovative, Professional.||Building software for tomorrow|
|HQ Location||United States||Sweden||United Kingdom||United States||Switzerland||Spain|
|Revenue||< $10m||< $10m||$10-100m||$10-100m||$10-100m||< $10m|
|Employees||51 - 200||11 - 50||201 - 1,000||201 - 1,000||51 - 200||11 - 50|
|Website||Open website||Open website||Open website||Open website||Open website||Open website|
indie designs and manufactures customized integrated circuits. They also manufacture chips they have designed for standard application requirements - ASSPs.
connectBlue is a leading provider of robust Industrial and Medical wireless solutions, designed and tested for the most demanding applications and environments. Based on Classic Bluetooth technology, Bluetooth Low Energy technology, Wireless LAN (WLAN) and IEEE 802.15.4 / Zigbee, connectBlue provides ready-to-use products and ready-to-embed modules as well as custom design solutions.
Mobica is a provider of Embedded Software engineering services. We operate out of the UK and Poland, and have an engineering team which provides outsourcing, consultancy and testing services across all major operating systems.
ATP Electronics is a leading solution provider of high performance, high quality and durable NAND flash and DRAM memory modules. With over twenty years of experience in service based memory products, ATP continues to focus on mission critical applications such as industrial/automation, telecom, medical, automotive, and enterprise computing where high levels of technical expertise, manufacturing quality, and wide operating temperature ranges are required. A certified Eco/Green partner of tier one OEMs, all ATP products are fully RoHS and China RoHS compliant. A true manufacturer, ATP offers in-house design, testing, and product tuning at both system and component levels. In addition, ATP supply chain support includes controlled/fixed BOMs and long-term product life cycles. The ATP System-In-Package (SIP) flash product manufacturing process is the backbone of superior build quality and durability. The industry leading SIP process involves advanced wire bonding, stacking, and encapsulation stages, which make ATP products consistently durable and reliable under harsh environments such as moisture, extreme temperature, and electrostatic discharge.
Toradex specializes in embedded computing technology, offering ARM®-based System on Modules (SOMs) and Customized SBCs. Complemented with direct online sales and long-term product availability, Toradex offers direct premium support and ex-stock availability with local warehouses. Founded in 2003 and headquartered in Horw, Switzerland, the company’s network stretches across the globe with additional offices in the USA, Vietnam, China, India, Japan, and Brazil.
SoC-e offers top quality outsourcing services for the development of FPGA and embedded systems for the industry. SoC-e takes advantage from the proven experience of the staff, from the strong link for R+D activities with cutting-edge research groups and from a well stabilised net of partners and suppliers. SoC-e focuses on product development, feasibility studies and technical research in the expertise areas of FPGA and embedded systems.
indie’s ASSPs (Application Specific Standard Products) are based on the same library of pre-approved analog and digital subsystems they use for their custom chips. However, because they are already designed and ready for manufacture, there are no engineering charges to pay and you can select and order these immediately. These devices are available now. The ASSPs are, broadly speaking, in three broad categories – General Purpose, High-Voltage/Automotive and Medical/Sensing. This means they are ideally suited for those applications – for example, all the Automotive products can support high-voltage and the Automotive “Load dump” requirements.
Hunter, Positron, Lynxsemi
|Technologies||Processors & Edge Intelligence||Processors & Edge Intelligence||Analytics & ModelingProcessors & Edge Intelligence||Processors & Edge Intelligence||Application Infrastructure & MiddlewareProcessors & Edge Intelligence||Processors & Edge Intelligence|
|Industries||Automotive||AutomotiveBuildingsConstruction & InfrastructureHealthcare & HospitalsRetail||AutomotiveFinance & InsuranceTelecommunications||AutomotiveHealthcare & HospitalsTelecommunications||AerospaceAutomotiveNational Security & DefenseRetail||AerospaceAutomotiveElectrical GridsRailway & Metro|
|Use Cases||Edge Computing & Edge Intelligence|
|Infrastructure as a Service (IaaS)||None||None||None||None||None||None|
|Platform as a Service (PaaS)||None||None||None||None||None||None|
|Application Infrastructure & Middleware||None||None||None||None||Minor||None|
|Analytics & Modeling||None||None||Minor||None||None||None|
|Cybersecurity & Privacy||None||None||None||None||None||None|
|Networks & Connectivity||None||None||None||None||None||None|
|Processors & Edge Intelligence||Minor||Minor||Minor||Moderate||Minor||Minor|
|Automation & Control||None||None||None||None||None||None|
|Partners||Microsoft AzureArmNXP SemiconductorsMarvell Technology GroupAltium Limited|