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ANSYS > 实例探究 > 提高燃料电池可靠性：巴拉德动力系统公司案例研究

提高燃料电池可靠性：巴拉德动力系统公司案例研究

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技术
  • 传感器 - 红外传感器
  • 传感器 - 热导传感器
适用行业
  • 汽车
  • 生命科学
用例
  • 室外环境监测
  • 根因分析与诊断
服务
  • 硬件设计与工程服务
关于客户
Ballard Power Systems Inc. 是一家从事电力行业的加拿大公司。该公司设计、开发和制造零排放质子交换膜燃料电池堆。巴拉德动力系统公司正在与领先的汽车制造商合作开发比内燃机更高效、更清洁的下一代发动机。使用巴拉德燃料电池的发动机可以帮助制造商达到汽车动力所需的新的环保性能水平。该公司的 Ballard MK9 系列电池电压监测 (CVM) 系统是用于汽车燃料电池堆的电子设备，可监测电池在运行过程中产生的电压。
挑战
Ballard Power Systems Inc. 是一家设计、开发和制造零排放 PEM 燃料电池堆的加拿大公司，其 MK9 系列电池电压监测 (CVM) 系统面临着重大挑战。这些系统用于汽车燃料电池堆，监测电池在运行过程中产生的电压。然而，该公司遇到了 CVM 芯片焊点故障，这可能会向车辆控制单元发出错误的故障信号，从而可能导致燃料电池甚至整个燃料电池发动机停止运行。这个问题直接影响整个燃料电池堆的可靠性。 PCB 和灌封材料（保护 CVM 免受环境影响）的热膨胀导致变形，从而对焊点产生应力。该公司需要深入了解热循环过程中电子元件的结构负载，确定应力过大可能导致 CVM 芯片早期故障的可能区域，并确定不会对 CVM 元件施加热膨胀应力的灌封材料。
解决方案
为了应对这一挑战，Ballard Power Systems Inc. 使用 ANSYS Multiphysics 软件进行热结构耦合场分析。该分析有助于计算电路板变形对焊点造成的应力。在装配模型上识别出高应力区域和组件。该软件还用于通过称为子建模的过程来开发更精细的网格，用于单个芯片/焊点细节分析。此过程有效地帮助计算特定感兴趣区域的更准确结果。在确定焊点应力是 CVM 焊点失效的主要原因后，该公司选择了一种具有合适热膨胀系数 (CTE) 的新型灌封材料。这种新材料消除了 CVM 芯片的应力成分并避免了故障。灌封材料接近 PCB 的 CTE，消除了其他测试材料的“凸起”。
运营影响
  • The solution implemented by Ballard Power Systems Inc. had significant operational results. By using thermal-structural coupled field analysis and submodeling, the company was able to pinpoint the primary cause of CVM solder joint failure and solve a major reliability problem. The selection of a new potting material with a suitable coefficient of thermal expansion (CTE) eliminated stress components for the CVM chip and averted failures. This not only improved the reliability of the CVM systems but also the overall reliability of the fuel cell stacks. The new potting material was close to the PCB’s CTE and eliminated the “bulge” of other material tested, reducing peak stress by more than 3X and eliminating the root cause of solder joint failure. The process verified that CVMs potted with the new material showed no sign of solder joint failure, further enhancing the reliability of the company's products.
数量效益
  • The process identified the primary cause of CVM solder joint failure, solving a major reliability problem.
  • The selection of a new potting material with a suitable coefficient of thermal expansion (CTE) eliminated stress components for the CVM chip and averted failures.
  • The new potting material reduced peak stress by more than 3X, eliminating the root cause of solder joint failure.
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