Suppliers Germany Balluff

Balluff

Sensors Worldwide
Germany
1921
Private
$100m-1b
1,001 - 10,000
Open website
With over 50 years of sensor experience, Balluff GmbH is a world leader and one of the most efficient manufacturers of sensor technology with company office in Neuhausen a.d.F. directly at Stuttgart.

The company offers sophisticated technology and very modern electronics application-specific customer solutions and an individual consultation and first-class service.
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The competitive advantage of Industry 4.0 and the Industrial Internet of Things (IIoT) is at your fingertips. The technology that enables these advantages is here now and well proven. Intelligent, connected systems provide scalability to seamlessly grow with your manufacturing needs. Are you ready to capitalize?

Our commitment is to the development and manufacture of sensors, identification systems and connectivity solutions for every area of industrial automation.

We already offer the necessary technologies for implementing Industry 4.0 and IIoT solutions.
• Integration in successive stages as budget and time allow
• Prioritize projects based on need with scalable implemention
• Capitalize on existing control architectures to quickly realize Industry 4.0 and IIoT
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Hardware
Processors provide the intelligence behind IoT systems and are often integrated into system-on-a-chip designs.
Hardware that enables dual directional communication for data collection and control message delivery. Examples include cellular, Ethernet, and Wi-Fi.
Sensors transform energy into electrical data; they are the eyes and ears of IoT. Actuators transform electrical data into energy; they are the muscle of IoT.
Technologies that enable legacy devices and other systems to connect to the IoT. They integrate technologies and protocols for networking.
Hardware products that are used by end users that contain IoT technology.
Software
Services
Number of News Items8
Protecting machine tools from cyberattacks
Canadian Metalworking - 09 Oct, 2019
Referenced Companies: Balluff
Keywords: Gates, Gateway, Sensor
Get Smarter About Automated Packaging at Pack Expo
Hydraulics & Pneumatics - 13 Sep, 2019
Referenced Companies: Beckhoff, Emerson, Balluff
Keywords: Predictive Maintenance, Register, Intelligent Devices, Robotics
QSC AG : AG joins Open Industry 4.0 Alliance to help standardise digital processes in industry | MarketScreener
MarketScreener - 14 Aug, 2019
Referenced Companies: SAP, Beckhoff, Balluff, Pepperl+Fuchs, KUKA AG
Keywords: Edge Computing, Edge Intelligence, Smart Factory
Number of Memberships1
IO-Link
IO-Link
IO-Link is the first standardised IO technology worldwide (IEC 61131-9) for the communication with sensors and also actuators. The powerful point-to-point communication is based on the long established 3-wire sensor and actuator connection without additional requirements regarding the cable material. So, IO-Link is no fieldbus but the further development of the existing, tried-and-tested connection technology for sensors and actuators.
Number of Similar Suppliers8
ADLINK
ADLINK
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BURNDY LLC
BURNDY LLC
Burndy is a global manufacturer of connectors, fittings and tools for electrical utilities, commercial, industrial and residential contractors, maintenance and repair companies, as well as the telecommunication and renewable energy markets. Burndy offers a wide range of grounding products along with all the necessary tooling and accessories.
Contrinex
Contrinex
Contrinex is a leading manufacturer of inductive and photoelectric sensors. The Swiss company, with headquarters in Givisiez, has developed a unique range of products whose performance far exceeds that of standard devices. Since its foundation in 1972, Contrinex has grown from a one-man concern into a small multi-national Group employing over 500 people worldwide. However, it still concentrates exclusively on the development, manufacturing and sales of sensing equipment for industrial applications.In particular, Contrinex has specialized in:- Miniature devices- Long operating distances- Resistance to extreme environmental conditions- Devices in full-metal housings
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